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Thermal & Reliability Study on High Current Thermal Vias & Output Pins应用指南

文件来源:SynQor
文件类型:pdf
更新时间:2011-02-18
文件大?。?84K
This application note addresses concerns raised with regards to pin and board heating when high currents (>60A) are driven through thermally relieved plated through hole (PTH) vias. Detailed thermal analysis will show that internal heat generation and resulting temperature rise of the power converter and load board is minimal when using a single thermally relieved via.
本文链接:http://www.5r3h.cn/power-dl/521
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